IC Packaging

We offer a wide portfolio of packaging & testing solutions in #1 manufacturing facilities.

Assembly

Once the product is designed & ready for manufacturing production, ISE Europe guides customers through the engineering/production phases, covering most of the available products in the market, such as:

  • QFN
  • QFP
  • BGA
  • CSP
  • WLCSP
  • Bumping
  • SOP
  • Flip Chip
  • Discrete
  • SIP Module

There are many things that we need to keep in mind from a manufacturing prospective. Engineering resource, BOM, logistics, IT system, forecast and capacity allocation are only a few examples, and any mistake here might cause unpleasant production issues.

To avoid this, ISE Europe will work closely with customers to ensure a smooth production flow.

Testing

ISE Europe provides all kind of test solutions for both wafer test and final test covering all different market applications: Digital, Mixed Signal and RF devices. The test engineering team provide full support during the development of customer’s solutions following all test requirements. Test solutions include:

Wafer Sort

  • High-Speed and Temperature Wafer testing
  • Temperature Control Probing and Cold Probing
  • From 6” to 12”
  • Wafer Mapping and Inking

Final Test

  • Multiple Sites testing
  • Handlers: Seiko/Epson, Delta Flex, Synax, etc.

Test platforms

  • Verigy
  • Advantest
  • Teradyne
  • LTX
  • Credence
  • Inovys